Soldered on ram and GPU.
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In that case, not at all is the right choice until AMD can figure out that frankly brain dead easy thing.
Oh yeah I'm sure you could've done it no problem
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There’s little point in framework selling a conventional desktop.
I guess they could have made another laptop size with the the dev time, but… I dunno, this seems like a niche that needs to be filled.
This is where I'm at. The Framework guy was talking about how very few companies are using this AMD deal because the R&D to add it to existing models wasn't very viable, you really only have the Asus Z13 so I feel like being ahead of the game there will be a benefit in the long run as far as their relationship with AMD. Plus they're also doing a 12-in laptop now as well, so it's not like they committed all their resources to this.
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Apparently AMD couldn’t make the signal integrity work out with socketed RAM. (source: LTT video with Framework CEO)
IMHO: Up until now, using soldered RAM was lazy and cheap bullshit. But I do think we are at the limit of what’s reasonable to do over socketed RAM. In high performance datacenter applications, socketed RAM is on it’s way out (see: MI300A, Grace-{Hopper,Blackwell},Xeon Max), with onboard memory gaining ground. I think we’ll see the same trend on consumer stuff as well. Requirements on memory bandwidth and latency are going up with recent trends like powerful integrated graphics and AI-slop, and socketed RAM simply won’t work.
It’s sad, but in a few generations I think only the lower end consumer CPUs will be possible to use with socketed RAM. I’m betting the high performance consumer CPUs will require not only soldered, but on-board RAM.
Finally, some Grace Hopper to make everyone happy: https://youtube.com/watch?v=gYqF6-h9Cvg
Sound like a downgrade to me I rather have more ram than having a soldered limited one. Especially for consumer stuff.
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I wasn't really thinking of HPC but my next gaming rig, TBH. The OS can move often accessed pages into faster RAM just as it can move busy threads to faster cores, gaining you some fps a second or two after alt-tabbing back to the game after messing around with firefox. If it wasn't for memory controllers generally driving channels all at the same speed that could already be a thing right now. It definitely already was a thing back in the days of swapping out to spinning platters.
Not sure about HBM in CPUs in general but with packaging advancement any in-package stuff is only going to become cheaper, HBM, pedestrian bandwidth, doesn't matter.
The thing is, consumers didn’t push Nvidias stock sky high, AI did. Microsoft isn’t pushing anything sane to consumers, Microsoft is pushing AI. AMD, Intel, Nvidia and Qualcomm are all pushing AI to consumers. Additionally, on the graphics side of things, AMD is pushing APUs to consumers. They are all pushing things that require higher memory bandwidth.
Consumer will get ”trickle down silicon”, like it or not. Out of package memory will die. Maybe not with you next gaming rig, but maybe the one after that.
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Soldered on ram and GPU. Strange for Framework.
Not strange at all.
They're a business that makes its money off of selling hype to morons.
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Sound like a downgrade to me I rather have more ram than having a soldered limited one. Especially for consumer stuff.
Sounds like a load of bullshit to feed useful idiots.
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Not strange at all.
They're a business that makes its money off of selling hype to morons.
Just buy a ThinkPad, if you’re thinking about buying a Framework…
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Sound like a downgrade to me I rather have more ram than having a soldered limited one. Especially for consumer stuff.
Looking at my actual PCs built in the last 25 years or so, I tend to buy a lot of good spec ram up front and never touch it again. My desktop from 2011 has 16GB and the one from 2018 has 32GB. With both now running Linux, it still feels like plenty.
When I go to build my next system, if I could get a motherboard with 64 or 128GB soldered to it, AND it was like double the speed, I might go for that choice.
We just need to keep competition alive in that space to avoid the dumb price gouging you get with phones and Macs and stuff.
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Apparently AMD couldn’t make the signal integrity work out with socketed RAM. (source: LTT video with Framework CEO)
IMHO: Up until now, using soldered RAM was lazy and cheap bullshit. But I do think we are at the limit of what’s reasonable to do over socketed RAM. In high performance datacenter applications, socketed RAM is on it’s way out (see: MI300A, Grace-{Hopper,Blackwell},Xeon Max), with onboard memory gaining ground. I think we’ll see the same trend on consumer stuff as well. Requirements on memory bandwidth and latency are going up with recent trends like powerful integrated graphics and AI-slop, and socketed RAM simply won’t work.
It’s sad, but in a few generations I think only the lower end consumer CPUs will be possible to use with socketed RAM. I’m betting the high performance consumer CPUs will require not only soldered, but on-board RAM.
Finally, some Grace Hopper to make everyone happy: https://youtube.com/watch?v=gYqF6-h9Cvg
There's even the next iteration already happening: Cerebras is maling wafer-scale chipa with integrated SRAM. If you want to have the highest memory-bandwith to your cpu core it has to lay exactly next to it ON the chip.
Ultimately RAM and processor will probably be indistinguishable with the human eye.
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You are correct, I’m referring to on package. Need more coffee.
No, it's a super common terminology almost to the point where I wouldn't really even consider it outright wrong to describe it as a SoC. It's just that the blurred distinction between a single chip and multiple chiplets packaged together are almost impossible for an outsider to tell without really getting into the published spec sheets for a product (and sometimes may not even be known then).
It's just more technically precise to describe them as SiP, even if SoC functionally means something quite similar (and the language may evolve to the point where the terms are interchangeable in practice).
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